seja bem vindo ao forum eof, caso nao seja cadastrado se cadastre para poder visualizar todo o conteudo ^^

Você não está conectado. Conecte-se ou registre-se

 » Hardware » Eletronica / Mecatronica / Robotica » [Download] Electromagnetic Compatibility Engineering

[Download] Electromagnetic Compatibility Engineering

Ir em baixo  Mensagem [Página 1 de 1]

susp3it0virtu@l

avatar
master
master
[Você precisa estar registrado e conectado para ver esta imagem.]
Electromagnetic Compatibility Engineering Hardcover – August 24, 2009
by Henry W. Ott (Author)

índice do livro:

PART 1 EMC THEORY

 1. Electromagnetic Compatibility
  1.1 Introduction
  1.2 Noise and Interference
  1.3 Designing for Electromagnetic Compatibility
  1.4 Engineering Documentation and EMC
  1.5 United States’ EMC Regulations
   1.5.1 FCC Regulations
   1.5.2 FCC Part 15, Subpart B
   1.5.3 Emissions
   1.5.4 Administrative Procedures
   1.5.5 Susceptibility
   1.5.6 Medical Equipment
   1.5.7 Telecom
   1.5.8 Automotive
  1.6 Canadian EMC Requirements
  1.7 European Union’s EMC Requirements
   1.7.1 Emission Requirements
   1.7.2 Harmonics and Flicker
   1.7.3 Immunity Requirements
   1.7.4 Directives and Standards
  1.8 International Harmonization
  1.9 Military Standards
  1.10 Avionics
  1.11 The Regulatory Process
  1.12 Typical Noise Path
  1.13 Methods of Noise Coupling
   1.13.1 Conductively Coupled Noise
   1.13.2 Common Impedance Coupling
   1.13.3 Electric and Magnetic Field Coupling
  1.14 Miscellaneous Noise Sources
   1.14.1 Galvanic Action
   1.14.2 Electrolytic Action
   1.14.3 Triboelectric Effect
   1.14.4 Conductor Motion
  1.15 Use of Network Theory
  Summary
  Problems
  References
  Further Reading
 2. Cabling
  2.1 Capacitive Coupling
  2.2 Effect of Shield on Capacitive Coupling
  2.3 Inductive Coupling
  2.4 Mutual Inductance Calculations
  2.5 Effect of Shield on Magnetic Coupling
   2.5.1 Magnetic Coupling Between Shield and Inner Conductor
   2.5.2 Magnetic Coupling—Open Wire to Shielded Conductor
  2.6 Shielding to Prevent Magnetic Radiation
  2.7 Shielding a Receptor Against Magnetic Fields
  2.8 Common Impedance Shield Coupling
  2.9 Experimental Data
  2.10 Example of Selective Shielding
  2.11 Shield Transfer Impedance
  2.12 Coaxial Cable Versus Twisted Pair
  2.13 Braided Shields
  2.14 Spiral Shields
  2.15 Shield Terminations
   2.15.1 Pigtails
   2.15.2 Grounding of Cable Shields
  2.16 Ribbon Cables
  2.17 Electrically Long Cables
  Summary
  Problems
  References
  Further Reading
 3. Grounding
  3.1 AC Power Distribution and Safety Grounds
   3.1.1 Service Entrance
   3.1.2 Branch Circuits
   3.1.3 Noise Control
   3.1.4 Earth Grounds
   3.1.5 Isolated Grounds
   3.1.6 Separately Derived Systems
   3.1.7 Grounding Myths
  3.2 Signal Grounds
   3.2.1 Single-Point Ground Systems
   3.2.2 Multipoint Ground Systems
   3.2.3 Common Impedance Coupling
   3.2.4 Hybrid Grounds
   3.2.5 Chassis Grounds
  3.3 Equipment/System Grounding
   3.3.1 Isolated Systems
   3.3.2 Clustered Systems
   3.3.3 Distributed Systems
  3.4 Ground Loops
  3.5 Low-Frequency Analysis of Common-Mode Choke
  3.6 High-Frequency Analysis of Common-Mode Choke
  3.7 Single Ground Reference for a Circuit
  Summary
  Problems
  References
  Further Reading
 4. Balancing and Filtering
  4.1 Balancing
   4.1.1 Common-Mode Rejection Ratio
   4.1.2 Cable Balance
   4.1.3 System Balance
   4.1.4 Balanced Loads
  4.2 Filtering
   4.2.1 Common-Mode Filters
   4.2.2 Parasitic Effects in Filters
  4.3 Power Supply Decoupling
   4.3.1 Low-Frequency Analog Circuit Decoupling
   4.3.2 Amplifier Decoupling
  4.4 Driving Capacitive Loads
  4.5 System Bandwidth
  4.6 Modulation and Coding
  Summary
  Problems
  References
  Further Reading
 5. Passive Components
  5.1 Capacitors
   5.1.1 Electrolytic Capacitors
   5.1.2 Film Capacitors
   5.1.3 Mica and Ceramic Capacitors
   5.1.4 Feed-Through Capacitors
   5.1.5 Paralleling Capacitors
  5.2 Inductors
  5.3 Transformers
  5.4 Resistors
   5.4.1 Noise in Resistors
  5.5 Conductors
   5.5.1 Inductance of Round Conductors
   5.5.2 Inductance of Rectangular Conductors
   5.5.3 Resistance of Round Conductors
   5.5.4 Resistance of Rectangular Conductors
  5.6 Transmission Lines
   5.6.1 Characteristic Impedance
   5.6.2 Propagation Constant
   5.6.3 High-Frequency Loss
   5.6.4 Relationship Among C, L and εr.
   5.6.5 Final Thoughts
  5.7 Ferrites
  Summary
  Problems
  References
  Further Reading
 6. Shielding
  6.1 Near Fields and Far Fields
  6.2 Characteristic and Wave Impedances
  6.3 Shielding Effectiveness
  6.4 Absorption Loss
  6.5 Reflection Loss
   6.5.1 Reflection Loss to Plane Waves
   6.5.2 Reflection Loss in the Near Field
   6.5.3 Electric Field Reflection Loss
   6.5.4 Magnetic Field Reflection Loss
   6.5.5 General Equations for Reflection Loss
   6.5.6 Multiple Reflections in Thin Shields
  6.6 Composite Absorption and Reflection Loss
   6.6.1 Plane Waves
   6.6.2 Electric Fields
   6.6.3 Magnetic Fields
  6.7 Summary of Shielding Equations
  6.8 Shielding with Magnetic Materials
  6.9 Experimental Data
  6.10 Apertures
   6.10.1 Multiple Apertures
   6.10.2 Seams
   6.10.3 Transfer Impedance
  6.11 Waveguide Below Cutoff
  6.12 Conductive Gaskets
   6.12.1 Joints of Dissimilar Metals
   6.12.2 Mounting of Conductive Gaskets
  6.13 The “IDEAL” Shield
  6.14 Conductive Windows
   6.14.1 Transparent Conductive Coatings
   6.14.2 Wire Mesh Screens
   6.14.3 Mounting of Windows
  6.15 Conductive Coatings
   6.15.1 Conductive Paints
   6.15.2 Flame/Arc Spray
   6.15.3 Vacuum Metalizing
   6.15.4 Electroless Plating
   6.15.5 Metal Foil Linings
   6.15.6 Filled Plastic
  6.16 Internal Shields
  6.17 Cavity Resonance
  6.18 Grounding of Shields
  Summary
  Problems
  References
  Further Reading
 7. Contact Protection
  7.1 Glow Discharges
  7.2 Metal-Vapor or Arc Discharges
  7.3 AC Versus DC Circuits
  7.4 Contact Material
  7.5 Contact Rating
  7.6 Loads with High Inrush Currents
  7.7 Inductive Loads
  7.8 Contact Protection Fundamentals
  7.9 Transient Suppression for Inductive Loads
  7.10 Contact Protection Networks for Inductive Loads
  7.10.1 C Network
  7.10.2 R–C Network
  7.10.3 R–C–D Network
  7.11 Inductive Loads Controlled by a Transistor Switch
  7.12 Resistive Load Contact Protection
  7.13 Contact Protection Selection Guide
  7.14 Examples
  Summary
  Problems
  References
  Further Reading
 8. Intrinsic Noise Sources
  8.1 Thermal Noise
  8.2 Characteristics of Thermal Noise
  8.3 Equivalent Noise Bandwidth
  8.4 Shot Noise
  8.5 Contact Noise
  8.6 Popcorn Noise
  8.7 Addition of Noise Voltages
  8.8 Measuring Random Noise
  Summary
  Problems
  References
  Further Reading
 9. Active Device Noise
  9.1 Noise Factor
  9.2 Measurement of Noise Factor
   9.2.1 Single-Frequency Method
   9.2.2 Noise Diode Method
  9.3 Calculating S/N Ratio and Input Noise Voltage from Noise Factor
  9.4 Noise Voltage and Current Model
  9.5 Measurement of Vn and In
  9.6 Calculating Noise Factor and S/N Ratio from Vn–In
  9.7 Optimum Source Resistance
  9.8 Noise Factor of Cascaded Stages
  9.9 Noise Temperature
  9.10 Bipolar Transistor Noise
   9.10.1 Transistor Noise Factor
   9.10.2 Vn–In for Transistors
  9.11 Field-Effect Transistor Noise
   9.11.1 FET Noise Factor
   9.11.2 Vn–In Representation of FET Noise
  9.12 Noise in Operational Amplifiers
   9.12.1 Methods of Specifying Op-Amp Noise
   9.12.2 Op-Amp Noise Factor
  Summary
  Problems
  References
  Further Reading
 10. Digital Circuit Grounding
  10.1 Frequency Versus Time Domain
  10.2 Analog Versus Digital Circuits
  10.3 Digital Logic Noise
  10.4 Internal Noise Sources
  10.5 Digital Circuit Ground Noise
   10.5.1 Minimizing Inductance
   10.5.2 Mutual Inductance
   10.5.3 Practical Digital Circuit Ground Systems
   10.5.4 Loop Area
  10.6 Ground Plane Current Distribution and Impedance
   10.6.1 Reference Plane Current Distribution
  10.6.2 Ground Plane Impedance
  10.6.3 Ground Plane Voltage
  10.6.4 End Effects
  10.7 Digital Logic Current Flow
   10.7.1 Microstrip Line
   10.7.2 Stripline
   10.7.3 Digital Circuit Current Flow Summary
  Summary
  Problems
  References
  Further Reading

PART 2 EMC APPLICATIONS

 11. Digital Circuit Power Distribution
  11.1 Power Supply Decoupling
  11.2 Transient Power Supply Currents
   11.2.1 Transient Load Current
   11.2.2 Dynamic Internal Current
   11.2.3 Fourier Spectrum of the Transient Current
   11.2.4 Total Transient Current
  11.3 Decoupling Capacitors
  11.4 Effective Decoupling Strategies
   11.4.1 Multiple Decoupling Capacitors
   11.4.2 Multiple Capacitors of the Same Value
   11.4.3 Multiple Capacitors of Two Different Values
   11.4.4 Multiple Capacitors of Many Different Values
   11.4.5 Target Impedance
   11.4.6 Embedded PCB Capacitance
   11.4.7 Power Supply Isolation
  11.5 The Effect of Decoupling on Radiated Emissions
  11.6 Decoupling Capacitor Type and Value
  11.7 Decoupling Capacitor Placement and Mounting
  11.8 Bulk Decoupling Capacitors
  11.9 Power Entry Filters
  Summary
  Problems
  References
  Further Reading
 12. Digital Circuit Radiation
  12.1 Differential-Mode Radiation
   12.1.1 Loop Area
   12.1.2 Loop Current
   12.1.3 Fourier Series
   12.1.4 Radiated Emission Envelope
  12.2 Controlling Differential-Mode Radiation
   12.2.1 Board Layout
   12.2.2 Canceling Loops
   12.2.3 Dithered Clocks
  12.3 Common-Mode Radiation
  12.4 Controlling Common-Mode Radiation
   12.4.1 Common-Mode Voltage
   12.4.2 Cable Filtering and Shielding
   12.4.3 Separate I/O Grounds
   12.4.4 Dealing With Common-Mode Radiation Issues
  Summary
  Problems
  References
  Further Reading
 13. Conducted Emissions
  13.1 Power Line Impedance
   13.1.1 Line Impedance Stabilization Network
  13.2 Switched-Mode Power Supplies
   13.2.1 Common-Mode Emissions
   13.2.2 Differential-Mode Emissions
   13.2.3 DC-to-DC Converters
   13.2.4 Rectifier Diode Noise
  13.3 Power-Line Filters
   13.3.1 Common-Mode Filtering
   13.3.2 Differential-Mode Filtering
   13.3.3 Leakage Inductance
   13.3.4 Filter Mounting
   13.3.5 Power Supplies with Integral Power-Line Filters
   13.3.6 High-Frequency Noise
  13.4 Primary-to-Secondary Common-Mode Coupling
  13.5 Frequency Dithering
  13.6 Power Supply Instability
  13.7 Magnetic Field Emissions
  13.8 Variable Speed Motor Drives
  13.9 Harmonic Suppression
   13.9.1 Inductive Input Filters
   13.9.2 Active Power Factor Correction
   13.9.3 AC Line Reactors
  Summary
  Problems
  References
  Further Reading
 14. RF and Transient Immunity
  14.1 Performance Criteria
  14.2 RF Immunity
   14.2.1 The RF Environment
   14.2.2 Audio Rectification
   14.2.3 RFI Mitigation Techniques
  14.3 Transient Immunity
   14.3.1 Electrostatic Discharge
   14.3.2 Electrical Fast Transient
   14.3.3 Lightning Surge
   14.3.4 Transient Suppression Networks
   14.3.5 Signal Line Suppression
   14.3.6 Protection of High-Speed Signal Lines
   14.3.7 Power Line Transient Suppression
   14.3.8 Hybrid Protection Network
  14.4 Power Line Disturbances
   14.4.1 Power Line Immunity Curve
  Summary
  Problems
  References
  Further Reading
 15. Electrostatic Discharge
  15.1 Static Generation
   15.1.1 Inductive Charging
   15.1.2 Energy Storage
  15.2 Human Body Model
  15.3 Static Discharge
  15.3.1 Decay Time
  15.4 ESD Protection in Equipment Design
  15.5 Preventing ESD Entry
   15.5.1 Metallic Enclosures
   15.5.2 Input/Output Cable Treatment
   15.5.3 Insulated Enclosures
   15.5.4 Keyboards and Control Panels
  15.6 Hardening Sensitive Circuits
  15.7 ESD Grounding
  15.8 Nongrounded Products
  15.9 Field-Induced Upset
   15.9.1 Inductive Coupling
   15.9.2 Capacitive Coupling
  15.10 Transient Hardened Software Design
   15.10.1 Detecting Errors in Program Flow
   15.10.2 Detecting Errors in Input/Output
   15.10.3 Detecting Errors in Memory
  15.11 Time Windows
  Summary
  Problems
  References
  Further Reading
 16. PCB Layout and Stackup
  16.1 General PCB Layout Considerations
   16.1.1 Partitioning
   16.1.2 Keep Out Zones
   16.1.3 Critical Signals
   16.1.4 System Clocks
  16.2 PCB-to-Chassis Ground Connection
  16.3 Return Path Discontinuities
   16.3.1 Slots in Ground/Power Planes
   16.3.2 Split Ground/Power Planes
   16.3.3 Changing Reference Planes
   16.3.4 Referencing the Top and Bottom of the Same Plane
   16.3.5 Connectors
   16.3.6 Ground Fill
  16.4 PCB Layer Stackup
   16.4.1 One- and Two-Layer Boards
   16.4.2 Multilayer Boards
   16.4.3 General PCB Design Procedure
  Summary
  Problems
  References
  Further Reading
 17. Mixed-Signal PCB Layout
  17.1 Split Ground Planes
  17.2 Microstrip Ground Plane Current Distribution
  17.3 Analog and Digital Ground Pins
  17.4 When Should Split Ground Planes Be Used?
  17.5 Mixed Signal ICs
   17.5.1 Multi-Board Systems
  17.6 High-Resolution A/D and D/A Converters
   17.6.1 Stripline
   17.6.2 Asymmetric Stripline
   17.6.3 Isolated Analog and Digital Ground Planes
  17.7 A/D and D/A Converter Support Circuitry
   17.7.1 Sampling Clocks
   17.7.2 Mixed-Signal Support Circuitry
  17.8 Vertical Isolation
  17.9 Mixed-Signal Power Distribution
   17.9.1 Power Distribution
   17.9.2 Decoupling
  17.10 The IPC Problem
  Summary
  Problems
  References
  Further Reading
 18. Precompliance EMC Measurements
  18.1 Test Environment
  18.2 Antennas Versus Probes
  18.3 Common-Mode Currents on Cables
   18.3.1 Test Procedure
   18.3.2 Cautions
  18.4 Near Field Measurements
   18.4.1 Test Procedure
   18.4.2 Cautions
   18.4.3 Seams and Apertures in Enclosures
  18.5 Noise Voltage Measurements
   18.5.1 Balanced Differential Probe
   18.5.2 DC to 1-GHz Probe
   18.5.3 Cautions
  18.6 Conducted Emission Testing
   18.6.1 Test Procedure
   18.6.2 Cautions
   18.6.3 Separating C-M from D-M Noise
  18.7 Spectrum Analyzers
   18.7.1 Detector Functions
   18.7.2 General Test Procedure
  18.8 EMC Crash Cart
   18.8.1 Mitigation Parts List
  18.9 One-Meter Radiated Emission Measurements
   18.9.1 Test Environment
   18.9.2 Limits for 1-m Testing
   18.9.3 Antennas for 1-m Testing
  18.10 Precompliance Immunity Testing
   18.10.1 Radiated Immunity
   18.10.2 Conducted Immunity
   18.10.3 Transient Immunity
  18.11 Precompliance Power Quality Tests
   18.11.1 Harmonics
   18.11.2 Flicker
  18.12 Margin
   18.12.1 Radiated Emission Margin
   18.12.2 Electrostatic Discharge Margin
  Summary
  Problems
  References
  Further Reading

APPENDIX

 A. The Decibel
  A.1 Properties of Logarithms
  A.2 Using the Decibel for Other than Power Measurements
  A.3 Power Loss or Negative Power Gain
  A.4 Absolute Power Level
  A.5 Summing Powers Expressed in Decibels
 B. The Ten Best Ways to Maximize the Emission from Your Product
 C. Multiple Reflections of Magnetic Fields in Thin Shields
 D. Dipoles for Dummies
  D.1 Basic Dipoles for Dummies
  D.2 Intermediate Dipoles for Dummies
  D.3 Advanced Dipoles for Dummies
   D.3.1 Impedance of a Dipole
   D.3.2 Dipole Resonance
   D.3.3 Receiving Dipole
   D.3.4 Theory of Images
   D.3.5 Dipole Arrays
   D.3.6 Very High-Frequency Dipoles
  Summary
  Further Reading
 E. Partial Inductance
  E.1 Inductance
  E.2 Loop Inductance
   E.2.1 Inductance of a Rectangular Loop
  E.3 Partial Inductance
   E.3.1 Partial Self-Inductance
   E.3.2 Partial Mutual Inductance
   E.3.3 Net Partial-Inductance
   E.3.4 Partial Inductance Applications
   E.3.5 Transmission Line Example
  E.4 Ground Plane Inductance Measurement Test Setup
  E.5 Inductance Notation
  Summary
  References
  Further Reading
 F. Answers to Problems
 Index

Download :

> Versão Russian (1979) edition:
magnet:?xt=urn:btih:PXVYR2ODWSLLVMRX45AC5LSNP53L53HN
magnet:?xt=urn:btih:RRG3EYU65U6FHIQ5TWPYYWQSFVHFMSFU
magnet:?xt=urn:btih:I3AEOZZDIOUFYLVQ3YXB2RWCTANVQEQN
> Second Edition (1988), in English
magnet:?xt=urn:btih:2ca945dcad546d6b00cce58c76da29aa66e4a00a
> The third edition (2009) in English
magnet:?xt=urn:btih:46edb82dca1a7f76e1aaee200b03eebcc88c3780

______________

Livro muito legal, estou estudando sobre EMC (Compatibilidade electromagnética)
uma loucura ... affraid


_________________ASSINATURA_________________

[Você precisa estar registrado e conectado para ver esta imagem.]

Frases:

-"Ninguém baterá tão forte quanto a vida.Porém,não se trata de quão forte pode bater,se trata de quão forte pode ser atingido e continuar seguindo em frente.É assim que a vitória é conquistada" - Rocky Balboa

-"Um homem não está acabado quando enfrenta a derrota. Ele está acabado quando desiste." - Richard Nixon

-"Sometimes,you have to demo a threat to spark a solution" - Barnaby Jack

Voltar ao Topo  Mensagem [Página 1 de 1]

Permissão deste fórum:
Você não pode responder aos tópicos neste fórum